COMPFLU is an international meeting for researchers in the interdisciplinary area of complex fluids and soft matter. COMPFLU meetings have been held in India, since 2002, to provide a forum for complex fluids or soft matter researchers from academia, research laboratories and industry to come together.
The 12th COMPFLU meeting (COMPFLU-2018) is being organized and hosted at IIT Roorkee, Uttarakhand, starting from 6th-9th December.
We are also planning to organize an Indo-US workshop on Soft Matter (IUWSM) from 9th-11th December in conjunction with the meeting.
Like last few versions of CompFlu, we will have multiple parallel sessions. This will allow a larger number of speakers to be accommodated. This format also allows us the freedom to have some participation from outside the country, to showcase the research being done in the country. We hope to draw speakers from all disciplines physicists, chemists, biologists, engineers who work on theory, simulations and experimental investigations of soft matter. We plan to have 12 sessions with 8 talks/session.
|Previous COMPFLU Meetings:|
|11.||2017||IIT Madras (Jointly with IIT Palakkad) More details...|
|10.||2016||IIT Hyderabad (Jointly with TIFR Hyderabad, University of Hyderabad, and International Institute of Information Technology, Hyderabad) More details...|
|9.||2016||CSIR-NCL Pune (Jointly with IISER Pune) More details...|
|6.||2012||IIT Guwahati More details...|
|5.||2010||IIT Madras More details...|
COMPFLU-2018 plans to have the following twelve (12) technical sessions. Complex fluids and soft matter researchers can enrich COMPFLU-2018 by sharing their exciting ideas through the following types of contributions/presentations:
|COMPFLU Sessions, Session Chairs and Invited Speakers|
|S. No.||Session Name||Sessions Chairs||Confirmed Invited Speakers|
|4.||Instabilities and Transitions||
|10.||Colloids and Interfaces||
|11.||Soft Condensed Matter||
|12.||Soft Matter in Industry||
Indo-US Workshop on Soft Matter (IUWSM-2018) is being organized, as part of the Indo-US Science and Technology Forum (IUSSTF) Joint Center on Engineering Applications of Designer Nanoparticle Assemblies.
This workshop is aimed at young researchers, such as PhD students (registered in 3rd year or above), postdoctoral fellows and other early career researchers from academia and industry. Speakers at the workshop will feature leading researchers in the area of polymers, nanoparticles, nanocomposites and self assembly.
The objective of the workshop is to provide a bird's eye view of emerging themes in self assembly of nanoparticles and how this is influenced by surface functionalization and the presence of a polymeric matrix. There will also be sessions that introduce basic concepts in polymer physics and that describe various experimental tools that are relevant to this research area.
|Day - 1 (December 09, 2018)|
|2:00 - 2:30 PM|| Registration
|2:30 -4:00 PM||
|4:00 - 4:30 PM||Tea Break||TBA|
|4:30 -6:00 PM||
|Day - 2 (December 10, 2018)|
|8:30 -10:00 AM||
|10:00 -11:30 AM||
|11:30 AM - 12:00 Noon||Tea Break||TBA|
|12:00 -01:30 PM||
|01:30 - 02:30 PM||Lunch Break||TBA|
|02:30 -04:00 PM||
|04:00 - 04:30 PM||Tea Break||TBA|
|04:30 -06:00 PM||
|Day - 3 (December 11, 2018)|
|9:00 -10:30 AM||
|10:30 AM -12:00 Noon||
|12:00 - 01:00 PM||High tea and certificates||TBA|
|Tentative list of the COMPFLU-2018 sessions||Feb 25, 2018|
|Invitation to the session chairs||Mar 01, 2018|
|Finalization of sessions and session chairs||Mar 15, 2018|
|Invitation to speakers||Apr 01, 2018|
|Abstract submission begins||Jun 15, 2018|
|Acceptance of invitation by Speakers||Jun 30, 2018|
|Final list of invited speakers||Jul 15, 2018|
|Last date of abstract submission||Aug 15, 2018|
|Acceptance notice on contributory talks and poster in COMPFLU||Sep 01, 2018|
|Registration for COMPFLU||Sep 01 - 15, 2018|
|Finalization of COMPFLU scientific program||Sep 15, 2018|
|Apply for IUWSM - 2018||Aug 01 - Sep 15, 2018|
|Acceptance notice for IUWSM applicants||Sep 30, 2018|
|Registration for IUWSM||Sep 30 - Oct 15, 2018|
|COMPFLU - 2018||Dec 06 - 09, 2018|
|IUWSM - 2018 (post-conference)||Dec 09 - 11, 2018|
We invite you to consider becoming a sponsor and support International Conference on Complex Fluids and Soft Matter (COMPFLU-2018), organized by the Department of Chemical Engineering at Indian Institute of Technology (IIT) Roorkee, India. The Indo-US Workshop on Soft Matter is also being organized as part of this 12th CompFlu meeting (COMPFLU-2018).
COMPFLU-2018 is an international meeting for researchers in the interdisciplinary areas of fluid mechanics, complex fluids or soft matter, nano- / bio- materials, etc. Compflu meetings have been held in India since 2002, and provide a platform for soft matter researchers from academia, research laboratories, and industry to come together and interact. This coneference provides an excellent oppurtunity to industries and other organizations showcase and promote their products to national and international delegates. It provides a suitable environment to interact with academicians, scientists, industry persons, and students.
Typical use of corporate support is to have larger students participation in COMPFLU-2018 at reduced fees without increasing the general registration. The student volunteers can also be benefited with complimentary registration with the help of such support. Exhibits by sponsors also help in sharing the current trends and updates to researchers about relevant applications and opportunities. Corporate support can be targeted to a particular activity of COMPFLU.
Your support is very important to the this meeting, and we ensures that the contributions will be duly acknowledged at suitable places. Kindly review the following available sponsorship opportunities and associated benefits.
|Level of Sponsorship||Benefits|
(Contributions of INR 5,00,000 or greater)
(Contributions of INR 3,00,000 or greater)
(Contributions of INR 1,50,000 or greater)
|COMPFLU Conference Fee||
|IUWSM Workshop Fee||
Please note that,
|Tel:||+91-967 536 3200 (PKJ); +91-735 128 8517 (GS); +91-941 069 4711 (RPB)|